Technical Education Quality Improvement Programme (TEQIP-III)
GOVERNMENT OF INDIA
MINISTRY OF EDUCATION
DEPARTMENT OF HIGHER EDUCATION
LOK SABHA
Technical Education Quality Improvement Programme
16. SHRIMATI RAKSHA NIKHIL KHADSE
Will the Minister of EDUCATION be pleased to state:
(a) whether the Government is making continuous efforts to convince the Focused State Governments to prepare a sustainability plan for the Technical Education Quality Improvement Programme (TEQIP-III) of the Government to continue the services rendered by the faculties engaged to upgrade the engineering education in the focused States;
(b) if so, the details thereof; and
(c) the steps taken/proposed to be taken by the Government to safeguard this technical force engaged under TEQIP-III for which the programme period has ended in March, 2021?
(SHRI DHARMENDRA PRADHAN)
(a) to (c): A statement is laid on the table of the House.
STATEMENT REFERRED TO IN REPLY TO PART (a) TO (c) OF THE LOK SABHA STARRED QUESTION NO. 16 FOR 19.07.2021 ASKED BY SHRIMATI RAKSHA NIKHIL KHADSE, HON’BLE MEMBER OF PARLIAMENT REGARDING TECHNICAL EDUCATION QUALITY IMPROVEMENT PROGRAMME.
(a to b) The Government of India has been making continuous efforts to ensure that the focus State Governments prepare a sustainability plan for the Technical Education Quality Improvement Programme (TEQIP-III). Several communications have been sent to the focus States requesting for preparation of a sustainability plan for filling up vacant faculty positions through regular recruitments so as to avoid any academic standstill beyond the project period i.e 30th September 2021.
Ministry of Education has also written to the Chief Secretaries of Focus States requesting to plan for continuation of activities undertaken during TEQIP-III, for maintaining the quality of technical education.
(c) Government of India has extended the TEQIP III project including the tenure of the temporary project faculties once from 30th September 2020 to 31st March 2021 and then finally up to 30th September 2021.
